216th ECS Meeting - Vienna, Austria

October 4 - October 9, 2009

PROGRAM INFORMATION
 

E2 - Atomic Layer Deposition Applications 5

Dielectric Science and Technology/Electronics and Photonics
 

Monday, October 5, 2009

Room C246, Level 02 - Red

Energy applications I - Photovoltaics

Co-Chairs: A.Londergan and P.Stair
TimeAbs#Title and Authors
09:30 Introductory Remarks (10 Minutes)
09:40   2010   Synthesis of Microscale Lead Sulfide Disks by Patterned Self-Assembled Monolayer T. Usui, N. P. Dasgupta, X. Jiang, W. Lee, and F. B. Prinz (Stanford University)
10:00   2011   Formation of Photovoltaic Buffer Layers by Atomic Layer Deposition J. R. Bakke and S. F. Bent (Stanford University)
10:20   2012   Quantum Dot Formation in Polymer Wires by Three-Molecule Molecular Layer Deposition and Applications to Electro-optic/Photovoltaic Devices T. Yoshimura, A. Oshima, and D. Kim (Tokyo University of Technology)
10:40 Intermission (10 Minutes)
 

Emerging applications I - Catalysis

Co-Chairs: S.De Gendt
TimeAbs#Title and Authors
10:50   2013   ALD of Vanadium Oxide J. Musschoot, D. Deduytsche, R. L. Van Meirhaeghe, and C. Detavernier (Ghent University)
11:10   2014   Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films M. E. Donders, H. Knoops, M. C. Van de Sanden, W. M. Kessels, and P. Notten (Eindhoven University of Technology)
11:30   2015   Performance and Characterization of ALD Vanadium Oxide Catalytic Nanoliths P. C. Stair (Northwestern University), J. Elam, J. Libera, H. Feng, M. Pellin (Argonne National Laboratory), and H. Kim (Northwestern University)
 

Emerging applications II - ZnO processes

Co-Chairs: S.Bent and A.W.Weimer
TimeAbs#Title and Authors
14:00   2016   Structures, Properties and Applications of Functional Thin Films by ALD K. Choy (The University of Nottingham)
14:30   2017   Atomic Layer Deposition of Quantum Confined Nanostructures on Particles D. M. King, X. Liang, J. Li, S. Johnson, and A. W. Weimer (University of Colorado)
14:50   2018   Zinc Oxide Growth by ALD and Thin Film Physical Characterization K. Tapily, D. Gu, H. Baumgart, G. Namkoong, and A. Elmustafa (Old Dominion University)
15:10   2019   Modeling and Characterization of ALD Grown ZnO Nanotubes and their Application to Sub-Micron Devices T. M. Abdel-Fattah (Christopher Newport University), D. Gu, H. Baumgart (Old Dominion University), R. Bajpai, and M. Zaghloul (George Washington University)
15:30   2020   The Benefits of Atomic Layer Deposition in Non-semiconductor Applications; Producing Metallic Nanomaterials and Fabrication of Flexible Display H. Kim, W. Kim, H. Lee, and S. Lim (POSTECH)
16:00 Intermission (20 Minutes)
 

High mobility substrates

Co-Chairs: S.De Gendt and J.W.Maes
TimeAbs#Title and Authors
16:20   2021   In Situ studies of ALD High-k/III-V Interfaces R. M. Wallace (University of Texas at Dallas)
16:50   2022   Atomic Layer Deposition of High-k Oxides on InAlN/GaN-Based Materials S. Abermann, C. Ostermaier, G. Pozzovivo, J. Kuzmik, O. Bethge, C. Henkel, G. Strasser, D. Pogany (Vienna University of Technology), C. Giesen (AIXTRON), M. Heuken (AIXTRON AG), M. Alomari (Institute of Electron Devices and Circuits (EBS)), E. Kohn (University of Ulm), and E. Bertagnolli (Vienna University of Technology)
17:10   2023   Effect of Surface Functionalization on TiO2 ALD on Ge(100) P. Ardalan, C. Musgrave, and S. F. Bent (Stanford University)
 

Tuesday, October 6, 2009

Room C246, Level 02 - Red

Emerging applications III - nanowires and particles

Co-Chairs: S.Bent and M.Putkonen
TimeAbs#Title and Authors
08:00   2024   ALD Applications Outside IC Technology: Existing and Emerging Possibilities M. I. Putkonen (Beneq Oy)
08:30   2025   Formation of Silicide Nanowires by Atomic Layer Deposition of Cobalt H. Lee and H. Kim (POSTECH)
08:50   2026   Particle ALD/MLD -Functionalization of Fine Particles (Invited) D. M. King, X. Liang, and A. W. Weimer (University of Colorado)
09:20   2027   ALD Synthesis of Tube-in-Tube Nanostructures of Transition Metal Oxides by Template Replication D. Gu (Old Dominion University), P. Shrestha (Old Dominion Univ.), H. Baumgart, G. Namkoong (Old Dominion University), and T. M. Abdel-Fattah (Christopher Newport University)
09:40 Intermission (20 Minutes)
 

Processing I - equipment and precursors

Co-Chairs: C.Hodson and N.Blasco
TimeAbs#Title and Authors
10:00   2028   New Materials and Emerging Applications of Plasma ALD C. Hodson and Q. Fang (Oxford Instruments Plasma Technology)
10:30   2029   Particle Performance of SUNALE(TM) ALD Batch Reactor K. Elers, J. Marles, P. Soininen (Picosun Oy), and J. Kostamo (Picosun)
10:50   2030   Highly Conformal ALD of ZrO2 at Higher Process Temperatures than the Conventional TEMAZr-Based Process Y. Senzaki, Y. Okuyama, G. Kim, H. Kim, C. Barelli, J. Lindner, Z. Karim, and S. Ramanathan (AIXTRON)
11:10   2031   Recent Development of ALD Precursors for Semiconductor Devices S. Wada (ADEKA Corporation)
11:30   2032   Sr and Ti Precursor Development for Next Generation Thin Films Applications R. Katamreddy, Z. Wang, V. Omarjee, P. V. Rao, C. Dussarrat, and N. Blasco (Air Liquide)
 

Processing II - metaloxide films

Co-Chairs: H.Knoops and S.Van Elshocht
TimeAbs#Title and Authors
14:00   2033   Densification, a Key Issue of the Atomic Layer Deposition of Hafnia onto Silicon: A Multimodel Investigation A. Esteve, C. Mastail, S. Olivier, M. Djafari Rouhani, G. Landa, and A. Dkhissi (laas-cnrs)
14:30   2034   Low Temperature Plasma-Enhanced Atomic Layer Deposition of Metal Oxide Thin Films S. E. Potts, L. R. Van den Elzen, G. Dingemans, E. Langereis, W. Keuning, M. C. Van de Sanden, and W. M. Kessels (Eindhoven University of Technology)
14:50   2035   Atomic Layer Deposition of GdAlOx and GdHfOx Using Gd(iPr-Cp)3 C. Adelmann (IMEC vzw.), D. Pierreux (ASM Belgium), J. Swerts, J. Kesters, O. Richard (IMEC vzw.), T. Conard (IMEC), A. Franquet, H. Tielens (IMEC vzw.), V. Afanasiev (Katholieke Universiteit Leuven), M. Schaekers (IMEC vzw.), S. Van Elshocht, and J. Kittl (IMEC)
15:10   2036   Novel "In Situ2" Approach to Modified ALD Processes for Nanofunctional Metal Oxide Films M. Tallarida (Brandenburgische Technische Universität), K. Karavaev, K. Kolanek, and D. Schmeisser (BTU-Cottbus)
15:30   2037   Extreme Scaled Gate Dielectrics by using ALD Hf-based Composite Materials D. Pierreux, V. Machkaoutsan (ASM Belgium), E. Tois (ASM Microchemistry), J. Swerts (IMEC vzw.), T. Schram (IMEC), C. Adelmann (IMEC vzw.), S. Van Elshocht, J. Tseng, L. Ragnarsson (IMEC), and J. W. Maes (ASM Belgium)
 

Processing III - metal fims

Co-Chairs: C.Adelmann and O.Vanderstraten
TimeAbs#Title and Authors
16:20   2038   Copper Oxide ALD from a Cu(I) Beta-Diketonate: Growth Studies and Application as Seed Layers for Electrochemical Copper Deposition T. Waechtler (Chemnitz University of Technology), L. Hofmann (Center for Microtechnologies, Chemnitz University of Technology), R. Mothes (Institute of Chemistry, Chemnitz University of Technology), S. Schulze (Institute of Physics, Chemnitz University of Technology), S. E. Schulz (Fraunhofer ENAS), T. Gessner (Fraunhofer Research Institution for Electronic Nano Systems (ENAS) and Center for Microtechnologies, Chemnitz University of Technology), H. Lang (Institute of Chemistry, Chemnitz University of Technology), and M. Hietschold (Institute of Physics, Chemnitz University of Technology)
16:40   2039   Liquid Injection Atomic Layer Deposition of Metallic Ru Thin Films from Ru(tmhd)3 and of High-k TiO2 Thin Films from Ti(O-i-Pr)2(tmhd)2 S. Hoffmann-Eifert, S. Kim (Forschungszentrum Juelich), and R. Waser (FZ Juelich)
17:00   2040   Ru-Si-N Thin Films Prepared by Plasma Enhanced Atomic Layer Deposition as a Diffusion Barrier of Direct Plating of Cu T. Eom, W. Sari, and S. Kim (Yeungnam University)
 

Gallery, Level 01 - Green

Poster session

Co-Chairs: A.Londergan and S.De Gendt
TimeAbs#Title and Authors
o   2041   Transmission and Reflection Properties of AlxTi1-xO Films for Si Thin Film Solar Cell J. Lim (ETRI), S. Lee, J. Kim (UST), S. Yun (ETRI), and J. Kim (Electronics and Telecommunications Research Institute)
o   2042   Effects of Pt/Al Top Electrode Selectively Formed by Metal Organic Chemical Vapor Deposition on Resistive Switching Properties of ALD TiO2 Thin Films J. Lee, K. Lee, A. Kim, and C. Lee (Kookmin University)
o   2043   Preparation of Pt-Deposited TiO2 Nanotubes by Atomic Layer Deposition C. Wang, Y. Hsueh (National Tsing Hua University), C. Kei (National Applied Research Laboratories), and T. Perng (National Tsing Hua University)
o   2044   Plasma-Enhanced Atomic Layer Deposition of Ta(C)N Thin Films for Copper Diffusion Barrier K. Kim, J. Yoon, Y. Kim, and S. Kwon (Pusan National University)
o   2045   Patterning of ALD HfO2 Layers on Silicon R. Andreu, J. Sanchez, A. Sanchez, M. Zabala, M. Acero, J. Rafi, and F. Campabadal (Institut de Microelectronica de Barcelona, CNM, CSIC)
o   2046   Optimizing the Release of ALD Grown Transition Metal Oxide Nanotubes from Anodic Aluminum Oxide Templates T. M. Abdel-Fattah (Christopher Newport University), D. Gu, H. Baumgart, and G. Namkoong (Old Dominion University)
 

Wednesday, October 7, 2009

Room C246, Level 02 - Red

Energy applications II - Storage

Co-Chairs: S.De Gendt and P.Banerjee
TimeAbs#Title and Authors
08:20   2047   Metal Alloy Catalysts with Pt Surface Coating by Atomic Layer Deposition for Intermediate Temperature Ceramic Fuel Cells J. Shim, X. Jiang, S. F. Bent, and F. B. Prinz (Stanford University)
08:40   2048   Atomic Layer Deposition for All-Solid-State 3D-Integrated Batteries H. Knoops, M. E. Donders, M. C. Van de Sanden, P. Notten, and W. M. Kessels (Eindhoven University of Technology)
09:10   2049   ALD Based Metal-Insulator-Metal Nanocapacitors for Energy Storage P. Banerjee, I. Perez, L. Henn-Lecordier, S. Lee, and G. W. Rubloff (University of Maryland)
09:40 Intermission (20 Minutes)
 

Capacitors and Memory

Co-Chairs: A.Londergan and U.Schroeder
TimeAbs#Title and Authors
10:00   2050   Detailed Correlation of Electrical Characteristics and Breakdown Properties to the Growth Behavior of ALD Deposited HfO2- and ZrO2-Based Dielectrics U. Schroeder (Namlab GmbH), W. Weinreich (Fraunhofer Center Nanoelectronic Technology), E. Erben (Qimonda Dresden), and J. Mueller (Fraunhofer Center Nanoelectronic Technology)
10:30   2051   Interface Analysis of Transparent Analog Capacitor Using ITO Electrodes and ALD High-k Dielectrics S. Won, M. Huh, S. Park, S. Seo, Y. Choi, J. Heo, C. Hwang, and H. Kim (Seoul National University)
10:50   2052   Atomic Layer Deposition of Ru and RuO2 for MIMCAP Applications C. Zhao, M. Pawlak, M. Schaekers, E. Sleeckx, E. Vancoille, D. Wouters, Z. Tokei, and J. Kittl (IMEC)
11:10   2053   MIMIM Trench Capacitors with Plasma-Assisted ALD Al2O3 and TiN Films D. Hoogeland (Eindhoven University of Technology), K. Jinesh (NXP Semiconductors), F. Roozeboom (University of Technology Eindhoven), W. Besling (NXP Semiconductors), W. Keuning (Eindhoven University of Technology), and F. Voogt (NXP Semiconductors)
11:30   2054   Atomic Layer Deposition of Materials for Phase-Change Memories M. Leskelä, V. Pore, T. Hatanpää, M. Heikkilä, M. Ritala (University of Helsinki), A. Schrott, S. Raoux, and S. Rossnagel (IBM)
12:00 Concluding Remarks (10 Minutes)